The world of high-power RF amplification is evolving, with industries such as defence, satellite communications, and wireless infrastructure demanding higher efficiency, greater power output, and improved reliability. As these applications push the limits of semiconductor technology, thermal management has emerged as a critical challenge—one that requires cutting-edge solutions.
At Euro Superabrasives, we are proud to be an official distributor of Element Six (E6) products, providing industry-leading CVD diamond heat spreaders that are transforming GaN-on-SiC RF power amplifier performance.
A recent case study conducted by Element Six, in collaboration with CITC – Chip Integration Technology Center and TNO Defence, Safety & Security, demonstrated the significant advantages of CVD diamond heat spreaders in improving the thermal and RF performance of GaN-on-SiC MMICs. The results reinforce why Element Six’s CVD diamond is the go-to solution for managing extreme heat flux in high-power electronics—a product line now available through Euro Superabrasives.
The Thermal Challenge in RF Power Amplifiers
GaN-on-SiC RF power amplifiers are widely recognised for their ability to deliver high power at high frequencies, but they also generate intense heat within a small volume. Without effective cooling solutions, these devices face:
· High junction temperatures, leading to reduced efficiency and lifespan
· Thermal limitations on power density, restricting overall RF performance
· Degradation of semiconductor reliability, increasing the risk of failure
To mitigate these challenges, advanced thermal management is essential, and CVD diamond heat spreaders offer the ultimate solution.
Why CVD Diamond Heat Spreaders?
Element Six’s Diafilm™ CVD diamond heat spreaders are engineered to deliver:
· Unmatched thermal conductivity – Up to 2200 W/mK, the highest of any known material
· Lower junction temperatures – Keeping semiconductor devices cooler, even at high power densities Enhanced reliability – Extending the lifespan of GaN-on-SiC MMICs
· Improved RF performance – Reducing thermal resistance and enabling higher efficiency operation
This technology ensures that RF power amplifiers can operate at higher power levels without performance degradation, a game-changer for industries relying on stable, high-frequency communications.
Case Study Validation: The Impact of CVD Diamond on GaN-on-SiC MMICs
A recent study conducted by Element Six, CITC, and TNO Defence, Safety & Security tested the performance of GaN-on-SiC MMICs mounted on CVD diamond heat spreaders compared to traditional CuMo mounting solutions.
Key Findings:
Temperature Reduction:
- The MMIC backside temperature was reduced by at least 25°C under typical operating conditions.
Thermal Resistance Improvement:
- The thermal resistance of the MMIC package was reduced by 30%, improving overall thermal efficiency.
Extended Pulse Width Operation:
- Thermal modelling indicated that GaN-on-SiC devices with diamond heat spreaders could operate at 10× to 100× longer pulse widths while maintaining safe temperatures.
These results demonstrate that CVD diamond is the most effective heat spreader available for high-power RF applications, making it essential for cutting-edge RF amplifier designs.
At Euro Superabrasives, we are committed to supplying the most advanced superabrasive solutions to industries where performance and reliability are non-negotiable. As an official distributor of Element Six products, we provide direct access to market-leading CVD diamond heat spreaders that are reshaping the future of RF power technology.
Why Choose Us?
· Exclusive access to Element Six products in the UK, Ireland, Scandinavia, Poland, Belgium, Israel, the Netherlands, and Iceland
· Expert technical support – Helping customers integrate CVD diamond solutions into their RF amplifier designs
· Reliable supply chain – Ensuring you get the materials you need, when you need them